Printed wiring board with a built-in resistive element

ABSTRACT

A printed wiring board with a built-in resistive element comprising a first electrode formed on the surface of an insulating member, a second electrode provided adjacent to the first electrode to form a space therebetween, a resistor-filling part formed by the space between the first electrode and the second electrode, and a resistive element comprising a resistive material provided in the resistor-filling part wherein the resistor-filling part is substantially enclosed by the first electrode and the second electrode.

RELATED APPLICATION

The present application is a divisional of and claims the benefit ofpriority from U.S. application Ser. No. 12/166,867, filed Jul. 2, 2008,which claims the benefit of U.S. Provisional Application Ser. No.60/992,820, filed Dec. 6, 2007. The entire contents of thoseapplications are incorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates generally to a printed wiring board, andmore specifically to a printed wiring board having a built-in resistiveelement.

DESCRIPTION OF THE RELATED ART

A printed wiring board mounts and secures semiconductor parts (activeparts) such as an IC or LSI, and electronic parts (passive parts) suchas an inductor, a resistor or capacitor so that they are electricallyconnected to each other. Therefore, a conventional printed wiring boardis formed by a conductive circuit formed on the surface as well asinside an insulating resin base board for mounting parts and a baseboard for mutual electrical connections.

SUMMARY OF THE INVENTION

One aspect of the invention includes a printed wiring board with abuilt-in resistive element. The printed wiring board includes a firstelectrode formed on the surface of an insulating member, a secondelectrode provided adjacent to the first electrode to form a spacetherebetween and a resistor-filling part formed by the space between thefirst electrode and the second electrode. A resistive element includes aresistive material provided in the resistor-filling part, wherein theresistor-filling part is substantially enclosed by the first electrodeand the second electrode.

Another aspect includes a method of manufacturing a printed wiring boardwith a built-in resistive element. The method includes forming a firstelectrode on a surface of an insulating member, forming a secondelectrode on the surface of the insulating member so as to form asubstantially enclosed space between the first and second electrodes. Aresistor material is filled into the substantially enclosed space.

Still another aspect includes a method of manufacturing a printed wiringboard with a built-in resistive element. The method includes forming afirst electrode on a surface of an insulating member, forming a secondelectrode adjacent to the first electrode to form a space therebetween,which provides a resistor-filling part between the first electrode andthe second electrode. A resistive element is formed by filling aresistive material provided in the resistor-filling part such that theresistor filling part is substantially enclosed by the first electrodeand the second electrode.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the invention and many of the attendantadvantages thereof will be readily obtained as the same becomes betterunderstood by reference to the following detailed description whenconsidered in connection with the accompanying drawings, wherein:

FIGS. 1A to 1C are diagrams describing a configuration and method ofproducing a representative resistive element in accordance with oneembodiment of the invention.

FIG. 1D is a cross-sectional diagram in the through-thickness directionof a typical printed-wiring board with a built-in resistive element,having the resistive element of FIGS. 1A to 1C.

FIGS. 2A to 2C are example embodiments modified from the electrodegeometry of FIG. 1A.

FIG. 3A to FIG. 3B are other example embodiments modified from theelectrode geometry of FIG. 1A.

FIG. 4A to FIG. 4D are diagrams showing example printed-wiring boardswith built-in resistive elements, with resistive elements formed on corelayers, respectively.

FIG. 5A to FIG. 5B are diagrams showing example printed-wiring boardswith built-in resistive elements, with resistive elements formed oninterlayer insulating resin layers of built-up layers, respectively.

FIG. 6A to FIG. 6G are diagrams describing a method of producing aprinted-wiring board with a built-in resistive element using a buildupmethod using a core layer in accordance with one embodiment of theinvention.

FIG. 7A is a diagram describing an example of a resistive element thathas the thickness of the resistor material larger than a thickness ofthe center electrode and the peripheral electrode.

FIG. 7B is a diagram describing and example of a resistive element thathas the thickness of the resistor material substantially equal to athickness of the center electrode and the peripheral electrode.

FIG. 8A is a diagram showing the configuration of a conventionalelectronic device 50.

FIG. 8B is a diagram showing an electronic device configured by usingthe printed-wiring board with a built-in resistive element in accordancewith an embodiment of the invention.

DETAILED DESCRIPTION OF EMBODIMENTS

Referring now to the drawings, wherein like reference numerals designateidentical or corresponding parts throughout the several views.

In recent years, in conjunction with the trend of electronic devicesbecoming faster and having a higher frequency, internally installingpassive parts onto a printed wiring board in advance is desirable inorder to enhance the quality property (signal integrity) of transmissionsignals. The present invention relates to a printed wiring board inwhich a resistive element as one of such passive parts has beenpreliminarily built-in.

Japanese Unexamined Patent Application Publication 2006-24740 “ResistiveElement and Multilayer Printed Wiring Board Incorporating the SameTherein” (Disclosure date: Jan. 26, 2006), the entire content of whichis hereby incorporated by reference, describes a printed wiring boardwith a built-in resistive element. In FIG. 1 and the abstract of thisreference, a square-shaped resistive element viewed as a plane drawinghas been described.

The resistance value R of such a square-shaped resistive element formedon a printed wiring board, such is proportional to the length L betweenboth electrodes and is inversely proportional to the area of across-section S of a resistive material. The area of the cross-section Sis determined by the width W and the height (thickness) t of theresistive material, R=ρ·L/S=ρ·L/(W·t), where ρ is the resistance ratedetermined by the resistive material.

Herein, when forming the resistive material by printing, the printingprecision of the resistive material becomes an issue. Specifically, inthe case of screen-printing of a resistive material onto a printedwiring board and further drying by heat or hardening by heat(hereinafter, simply referred to as “thermal drying”), controlling thewidth W and the height (thickness) t of the resistive material with veryhigh precision is difficult. Consequently, the resistance valuetolerance (variance) of the resistive element inevitably tends to begreater.

In view of the abovementioned objective, a purpose of the presentinvention is to provide a new printed wiring board with a built-inresistive element capable of reducing the resistance value tolerance(variance) of the resistive element and electronic apparatus using thesame.

According to embodiments of the present invention, a new printed wiringboard with a built-in element capable of reducing the resistance valuetolerance (variance) of the resistive element and electronic apparatususing the same may be provided.

Hereinafter, with regard to a printed wiring board with a built-inresistive element related to the present invention and an electronicapparatus using the same, the embodiment will be described in detailwhile referring to the attached drawings. Furthermore, the samereference symbols are given for the same or similar components in thedrawings, and redundant descriptions are generally omitted.

FIGS. 1A to 1C are diagrams describing the structure and method ofproducing a representative resistive element 10-1. As shown in FIG. 1A,this resistive element 10-1 has two electrodes. For example, theseelectrodes may be a circular center electrode 14-1 and a toricperipheral electrode 12-1 surrounding the circular center electrode. Anextracting conductor from the center electrode 14-1 may be athrough-hole conductor (not shown) or a via conductor (not shown). Anextracting conductor from the peripheral electrode 12-1 may be athrough-hole conductor (not shown) or a via conductor (not shown) formedon the toric peripheral electrode 12-1 or an extracting conductorpattern 12-1 a from the peripheral electrode.

In an embodiment, space between the center electrode 14-1 and theperipheral electrode 12-1 is enclosed. Additionally, such space has thesame radial length around the circumference.

As shown in FIG. 1B, a resistor material 18 is screen-printed on theentire space formed between the two electrodes. This resistor material18 is typically resistive paste (referred to as “carbon paste” due tothe quality of the material in most cases). This resistive paste 18preferably has, for example, heat-hardening resin and conductive filleras main components. For heat-hardening resin, heat-hardening resin suchas epoxy resin, phenol resin, melamine resin, polyimide resin, and thelike, and resin with the above resins degenerated, or a mixture of theseresins, thermoplastic resins, and the like may be used. Of these, it ispreferable to use epoxy resin or phenol resin from the perspective ofadhesion to a substrate, chemical resistance, and cost. For conductivefiller, it is preferable to use inexpensive carbon such as ketjen black,acetylene black, graphite, activated carbon, and the like. Besidesconductive filler, inorganic filler such as silica may be added.Commercially available carbon paste may be used as-is.

Carbon paste such as resistive paste manufactured by Shoei ChemicalInc., Ru resistive paste by Sumitomo Metal Mining Co., Ltd., resistor byTanaka Kinzoku Group, polymer type resistive paste by Asahi ChemicalResearch Laboratory Co., Ltd., and the like may be used, and these arecommercially available on the market. After the resistor material 18 isprinted, it is thermally dried. In an embodiment, resistive element 10-1comprises a resistive material. In another embodiment, the resistiveelement may include two electrodes and a resistor material formedbetween those electrodes.

As shown in FIG. 1C, the resistor material 18 may be printed off to theoutside of the peripheral electrode 12-1. The resistance value of theresistive element 10-1 shown in FIG. 1C is the same as that shown inFIG. 1B. Furthermore, as long as the resistor material 18 is printed onthe entire surface of the space between the two electrodes, the resistormaterial 18 may not be printed on part of the surface of the peripheralelectrode 12-1 or the center electrode 14-1.

Geometries of the center electrode 14-1 and the peripheral electrode12-1 are patterned and formed with a subtractive method, semi-additivemethod (SAP), full-additive method, or the like. Of these, thesemi-additive method (SAP) is preferable from the perspective thatelectrodes with very high precision can be formed and the space(interspace) surrounding the two electrodes can also be formed with veryhigh precision.

As shown in FIG. 1A, the resistance value of the resistive element 10-1is determined by the resistivity p of the resistor material, the length(i.e., distance between the two electrodes) L, the width (i.e., lengthof circular line running through the middle of the toric space formedbetween the two electrodes) W, and the thickness t of the printresistance. Of these, the distance L and the width W are determined bythe geometries of the two electrodes, so they are formed with very highprecision. Consequently, the resistance tolerance of the resistiveelement 10 can naturally become lower.

In other words, by forming the center electrode 14-1 and the peripheralelectrode 12-1 with high precision with the semi-additive method (SAP),for example, the space (interspace) between the two electrodes can bemaintained at high precision. If the resistor material is printed on theentire enclosed space between the two electrodes, it is not necessary tostrictly control across-the-width application of the resistor materialin printing for the purpose of reducing resistance tolerance as in thecase of forming a conventional rectangular resistive element. Morespecifically, even if the resistor material is printed slightly offcenter, reduction of resistance tolerance can be achieved.

FIG. 1D is a cross-sectional diagram in the through-thickness directionof a printed-wiring board with a built-in resistive element 26 using theabove resistive element 10. This printed-wiring board has a core layer20 and built-up layers 38 u, 38 d respectively formed on the core layer.The resistive element 10 is formed on the upper surface of the corelayer 20.

The circular resistance 10-1 shown in FIG. 1B or 1C will be explainedfrom the design aspect. Calculation of a resistance value R is the sameas a rectangular resistor material. A resistance value R of a resistormaterial is shown in R=ρ·(L/S), wherein the section area S of theresistor material is shown in multiplication of the width W and theheight (thickness) t of the resistor material.

If the thickness t is included in the resistivity p, the resistancevalue R is R=ρ{L/(W·t)}=(ρ/t)·(L/W)=Rs·(L/W), wherein Rs is referred toas sheet resistance. The sheet resistance Rs is one of the methods ofexpressing the resistance of a film with a consistent thickness, and theunit is (Ω/□) (ohm/square). In other words, it is a resistance value ofa square (L=W) resistive film.

The resistance value R of the circular resistance shown in FIGS. 1B and1C is shown as in Table 1 with print resistance of 100 (Ω/□) of sheetresistance. See FIG. 1A for the numerals of Table 1. The length of theperipheral electrode E1 and the through-hole diameter Dpth formed on theback surface of the center electrode are consistent. As shown above, theresistive element 10 can be designed after a target resistance value isset in advance.

TABLE 1 No. L (μm) W (μm) R (Ω) E1 (μm) Dpth (μm) 1 250 2.28 × 10³ 11250 475 2 150 1.96 × 10³ 7.7 3 100 1.81 × 10³ 5.5 4 75 1.73 × 10³ 4.3

FIGS. 2A to 2C are modified examples of circular geometries of theelectrodes of FIG. 1A. The resistor material is not shown below, but inFIG. 2A (1), a center electrode 14-2 is a triangle and a peripheralelectrode 12-2 is the geometry of a triangular frame. In FIG. 2B (1), acenter electrode 14-3 is rectangular, peripheral electrode 12-3 is ageometry of a rectangular frame. As for other polygons, although notshown in the drawings, the center electrode can be an n-gon, and theperipheral electrode can be an n-gonal frame (wherein, n=3, 4, 5, . . .). FIG. 2C (1) shows the same geometries of the electrodes shown in FIG.1A.

However, when electrode geometries are generalized, the center electrodemay be any geometry. Moreover, the peripheral electrode may be anygeometry as long as it substantially or completely surrounds the centerelectrode. Moreover, the center electrode is not necessarily formed inthe center of the peripheral electrode, and may be off centered. Inother words, the space between the two electrodes may preferably be anenclosed area. The two electrodes are formed with very high precision bypatterning.

Therefore, as long as the space enclosed between the two electrodes canbe formed, it is unnecessary to strictly control the width of a resistormaterial in printing such resistor material. More specifically, even ifa resistor material is printed slightly off center, the length and widthof the resistor material that naturally makes the resistance toleranceoptimal can be obtained if these two electrodes are accurately formedand the resistor material is printed on the entire space between them,because the width of the resistor material depends on the formingprecision between the two electrodes. In particular, the length andwidth of the resistor material printed on the space between the twoelectrodes can be formed with very high precision. Consequently, thismay reduce the resistance tolerance of the resistive element.

Moreover, the space between these two electrodes is not necessarilycompletely enclosed. More specifically, as shown in FIG. 3A, positiveand negative electrodes 12-4, 14-4 forming a resistive element may beformed in whorl respectively, and, as shown in FIG. 3B, positive andnegative electrodes 12-5, 14-5 forming a resistive element may be formedin angled brackets. With a structure in which the space between a pairof electrodes as above is not enclosed and the space between such pairof electrodes is opened, the space between the two electrodes can beregarded as substantially enclosed unless it is in a range that affectsthe resistance tolerance.

Furthermore, in the resistive element 10-2 with the triangle electrodesshown in FIG. 2A (1), the resistive element 10-3 with square electrodesshown in FIG. 2B (1), and the resistive element 10-1 with circularelectrodes shown in FIG. 2C (1), the resistance values can be calculatedin advance relatively easily.

However, with regard to other electrode geometries, more than one samplethat has electrodes with slightly different dimensions (morespecifically, similar electrodes) is formed in advance using asingle-layer substrate, a resistor material 18 is printed and thermallydried, and the size of the electrodes with an intended resistance valuecan be determined via an experiment by sequentially measuring resistancevalues of these samples.

In the end, the electrode geometry may preferably be one of thefollowing:

(1) Electrodes that form space enclosed between two electrodes;

(2) A center electrode and a peripheral electrode that surrounds it;

(3) A circular center electrode and a toric peripheral electrode;

(4) A center electrode that is an n-gon and a peripheral electrode thatis an n-gonal frame (wherein, n=3, 4, 5, . . . ).

With these electrode geometries, the space enclosed between the twoelectrodes can be formed, and by printing the resistor material on theentire surface of this space and thermally drying, the resistive element10 can be formed with high precision of resistance value.

The extracting conductor from the peripheral electrode 12 generally doesnot affect the space between the two electrodes or cause problems. Whenthe extracting conductor from the center electrode 14 is a through-holeconductor or a via conductor, it generally does not effect the spacebetween the two electrodes or cause problems.

However, due to the design, a through-hole conductor or a via conductormay not be possible to be formed for the center electrode 14. In thiscase, a conductor pattern has to be extracted from the center electrode14. FIG. 2A (2) is an example of a resistive element 10-2 with triangleelectrodes shown in FIG. 2A (1) in which a part of a peripheralelectrode 12-2 b is eliminated and an extracting conductor pattern 14-2a from a center electrode 14-2 is formed. FIG. 2B (2) is an example of aresistive element 10-3 with square electrodes shown in FIG. 2B (1) inwhich a part of a peripheral electrode 12-3 b is eliminated and anextracting conductor pattern 14-3 a from a center electrode 14-3 isformed. FIG. 2C (2) is an example of a resistive element 10-1 withcircular electrodes shown in FIG. 2C (1) in which a part of a peripheralelectrode 12-1 b is eliminated and an extracting conductor pattern 14-1a from a center electrode 14-1 is formed. As for other polygons,although not shown in the drawings, an extracting conductor pattern froma center electrode can also similarly be formed.

With these electrode geometries, the space between the two electrodes isnot completely enclosed. However, the space between the two electrodesis mostly enclosed (more specifically, substantially enclosed), and thetwo electrodes are formed with high precision, for example, with thesemi-additive method, so the length and width of the resistor materialcan be formed mostly accurately. Consequently, printing of the resistormaterial 18 on the entire space between these two electrodes andthermally drying it makes the resistance tolerance of the resistiveelement 10 lower than conventional rectangular resistance. Morespecifically, even if the printing precision is slightly poor (e.g., asin FIG. 1C, the resistor material is not exactly on the peripheralelectrode), the resistance tolerance is not affected at all.

Furthermore, it is important to pay attention so that the resistormaterial is not printed on the portion where the extracting conductorpattern 14-2 a, etc., passes the eliminated portion of the peripheralelectrode 12-2 b, etc. (more specifically, space between the extractingconductor pattern and the peripheral electrode). This space between thetwo electrodes is very narrow and open between the two electrodes, andthis prevents electrical current from passing through this space by theresistor material being printed on this space.

The abovementioned resistive element 10 can be formed on variousprinted-wiring boards. The present applicant often adopts a buildupmethod using a core layer as a method of manufacturing printed-wiringboards. Therefore, a printed-wiring board with a built-in resistiveelement manufactured with the buildup method using a core layer isexplained herein.

The buildup method using a core layer is a manufacturing method withwhich insulating layers are formed one-by-one on a core layer generallyproduced via the PTH (Plated Through Hole) method to create a conductorpattern, which are connected between the layers and are multi-layered bylaminating the conductor layers. On the core layer, a through-holeconductor and a pattern conductor are formed on an insulating substrate.On a buildup layer laminated on the core layer, a via conductor and apattern conductor on an insulating layer are formed.

The resistive element may be considered only the resistive materialwithin the space formed by the electrodes, or can be considered theresistive material as well as the electrode and other structuresassociated with the resistive material. Table 2 shows classificationsand a summary of the printed-wiring board with a built-in resistiveelement according to locations where the resistive element 10 is formedand types of conductors connected to the two electrodes.

TABLE 2 Conductor Conductor Forming connected to connected to the No.location one electrode other electrode Drawing 1 Core layer PTHcover-plating Pattern FIG. 4A 2 Via TH land FIG. 4B 3 Via TH land FIG.4C 4 PTH cover-plating TH land FIG. 4D 5 Buildup Via topland PatternFIG. 5A 6 layer Via bottomland Pattern FIG. 5B

The resistive element 10 of the printed-wiring board with a built-inresistive element 26-1 shown in FIG. 4A has a PTH cover (or lid) platedconductor 28 c as one electrode (center electrode) and a conductorpattern 20 p on the surface of a core substrate 20 as the otherelectrode (peripheral electrode). A filling material 25 is filled in theinterior portion of the PTH 28, and a PTH cover (or lid) platedconductor 28 c formed with high precision, for example, with thesemi-additive method or tinting method is formed with the resistormaterial 18 formed on the upper surface. Additionally, the conductorpattern 20 p is a circular shape surrounding the PTH cover (or lid)plated conductor 28 c.

The resistive element 10 of the printed-wiring board with a built-inresistive element 26-2 shown in FIG. 4B has a via conductor 23 as oneelectrode (center electrode) and a TH (through-hole) land 281 as theother electrode (peripheral electrode). The filling material 25 isfilled in the interior portion of the PTH, and the resistor material 18is formed on the upper surfaces of the filling material and the PTH pad.In the embodiment of FIG. 4B, a cover (or lid) plated conductor forcovering the filling material in the interior portion of the PTH is notformed.

The resistive element 10 of the printed-wiring board with a built-inresistive element 26-3 shown in FIG. 4C has a via conductor 23 on THcover (or lid) plating as one electrode (center electrode) and an outeredge 28 e on the TH cover (or lid) plating 28 c as the other electrode(peripheral electrode). In this case, the filling material 25 is filledin the interior portion of the PTH, and a groove 29 is formed on theperipheral portion of a via conductor 23 on the TH cover (or lid)plating 28. Thereby, the central portion 28 d and the outer edge 28 eare separated. Additionally, the via conductor 23 is formed on thatcentral portion 28 d. Furthermore, in this configuration, the viaconductor 23 on the TH cover (or lid) plating 28 c is not essential. Inthis case, the inner portion is regarded as the center electrode withthe groove 29 provided on the TH cover (or lid) plating 28 c as aboundary, and the outer portion is regarded as the peripheral electrodewith said groove as a boundary.

The resistive element 10 of the printed-wiring board with a built-inresistive element 26-4 shown in FIG. 4D has a central portion 28 d of aTH cover (or lid) plating 28 c as one electrode (peripheral electrode)and an outer edge 28 e of a TH cover (or lid) plating 28 c as the otherelectrode (center electrode). The filling material 25 is filled in theinterior portion of the PTH, the PTH cover (or lid) plated conductor 28c is partially formed on this filling material, and a via conductor 23is formed on the upper surface of the PTH cover (or lid) platedconductor.

The printed-wiring board with a built-in resistive element 26-5 shown inFIG. 5A has a resistive element 10 that has a first conductor circuit 20p formed on the surface of a first insulating member 20, secondconductor circuits 23 t, 23 p formed on the surface of a secondinsulating member 22 u, which is located on the first insulating member,and a via conductor 23 that connects the first conductor circuit and thesecond conductor circuits, and has said second conductor circuits 23 t,23 p as the two electrodes. More specifically, the resistor material 18is formed on a built-up layer (a first interlayer insulating resin layer22 u). In this case, one of the electrodes (center electrode) is atopland 23 t of a via conductor 23, and the other electrode (peripheralelectrode) is the conductor pattern 23 p formed on the periphery of thetopland 23 t of the via conductor 23. Additionally, the conductorpattern 23 p is a circular shape surrounding the topland 23 t of the viaconductor 23.

The printed-wiring board with a built-in resistive element 26-6 shown inFIG. 5B has a resistive element 10 that has first conductor circuits 23p, 23 b formed on the surface of a first insulating member 22 u, asecond conductor circuit 24 p formed on the surface of a secondinsulating member 24 u, which is on the first insulating member, and avia conductor 23 that connects the first conductor circuits and saidsecond conductor circuit, and has the first conductor circuits as thetwo electrodes. More specifically, the resistor material 18 is formed ona built-up layer (a first interlayer insulating resin layer 22 u). Oneof the electrodes (center electrode) is a bottomland 23 b of the viaconductor 23, and the other electrode (peripheral electrode) is aconductor pattern 23 p formed on the periphery of the bottomland 23 b ofthe via conductor 23. Additionally, the conductor pattern 23 p is acircular shape surrounding the bottomland 23 b of the via conductor 23.

Furthermore, if the via conductor is not filled, a void may occur byprinting the resistor material 18 on the hollow via conductor, though itis not shown in a diagram, and thus, it is preferable to avoid such ahollow portion as much as possible in forming the resistor material 18.

It is appreciated that the descriptions above are examples, and theresistor material 18 can be formed on other locations as needed.

Subsequently, an example method of manufacturing a printed-wiring boardwith a built-in resistive element using the buildup method using a corelayer will be briefly explained.

As shown in FIG. 6A, a core substrate 20 is prepared. This coresubstrate 20 is produced with a plated through-hole method. An innerlayer conductor pattern is formed on a glass fabric epoxy resin copperclad laminate or glass fabric high-heat-resistant resin copper cladlaminate, and the necessary number of these is prepared, and laminatedand adhered with adhesive sheets called prepreg in order to form oneplate. A hole is made on this, and the wall surface and surface of thehole are plated with a plated through-hole method to connect the innerand outer conductor layers. Subsequently, a surface conductor patternand electrode conductors (not shown) of the resistive element arecreated in order to produce the core substrate 20. As for plating, amethod such as the subtractive method in which the entire surface can beplated and then a necessary area is etched, or the semi-additive method,full-additive method, or the like may be used.

When the resistive element 10 is formed on the core layer 20 explainedin association with FIG. 4A-FIG. 4D, both electrode conductors areformed at this stage. Subsequently, the resistive paste 18 is printed onthe enclosed space between these two electrodes and is thermally driedto form the resistive element 10.

As shown in FIG. 6B, insulating layers 22 u, 22 d are formed on the coresubstrate 20 and a resistive element (not shown). These insulatinglayers are formed by coating liquid or a lamination method in which afilm is heated and clamped in vacuo.

As shown in FIG. 6C, holes 23 h are made on the insulating layers 22 u,22 d via laser.

As shown in FIG. 6D, an electroless copper plating layer is precipitatedon the inner surfaces of the holes and the surfaces of the insulatinglayers to make them conductive. At this time, to enhance the adhesion ofthe plating, the inner surfaces of the holes and the surfaces of theinsulating layers are roughened.

As shown in FIG. 6E, conductor patterns 22 uc on the surface andelectrode conductors (not shown) of the resistive element are formed. Toform the conductor patterns and electrode conductors, panel plating,which is electrolytic copper plating, is performed on the entire surfacefollowed by etching to form the conductor patterns (subtractive method).Furthermore, other methods, for example, the semi-additive method,full-additive method, or the like can be used.

When the resistive element 18 is formed on the built-up layer explainedin association with FIG. 5A to FIG. 5B, electrode conductors are formedat this stage. Subsequently, the resistive paste 18 is printed on theenclosed space between these two electrodes and is thermally dried toform the resistive element 10.

As shown in FIG. 6F, conductor patterns 22 dc and electrode conductors(not shown) on the back surface are similarly formed. In the samemanner, when a resistive element 10 is formed on this built-up layer,electrode conductors are formed at this stage, and the resistive paste18 is printed on them and thermally dried to form the resistive element10.

A first layer of each of the conductor patterns on the upper surface andlower surface is formed on the core layer 20 at this stage, so theprocess of FIG. 6B to FIG. 6F is repeated as many times as desired. Atthis time, the resistive element 10 can be formed on the desired layer.

As shown in FIG. 6G, by repeating the process of FIG. 6B to FIG. 6F onemore time, a multilayer printed-wiring board is produced. A solder masklayer (not shown) can be formed on the outermost layer as needed.

As shown in FIG. 1D and FIGS. 4A, 4C, 5A and 5B, it has been explainedthat the thickness of the resistor material 18 is preferably thickerthan the thickness of the center electrode and peripheral electrode.However, it is not limited to the above.

FIG. 7A is a cross-section diagram of the printed-wiring board with abuilt-in resistive element 26 in FIG. 1D at a stage in which the centerelectrode 14-1 and the peripheral electrode 12-1 are formed on the corelayer 20, and the resistor material 18 is formed by being printed on thespace between the two electrodes. The thickness of the resistor material18 is preferably thicker than the thickness of the two center electrode14-1 and the peripheral electrode 12-1 herein.

At this time, as shown in FIG. 7B, the resistor material 18 may bescraped with a squeegee or another appropriate means prior to thethermal dry process to make the thickness of the resistor material 18substantially equal to the thickness of the center electrode 14-1 andthe peripheral electrode 12-1. As in the above, a resistive element thathas the resistor material 18 sufficiently filled in the space betweenthe two electrodes but not covering the center electrode 14-1 and theperipheral electrode 12-1 can further make the resistance tolerancelower than the resistive element in FIG. 7A.

Such resistive element that has the thickness of the resistor materialsubstantially equal to the thickness of the center electrode and theperipheral electrode can also be adopted in the printed-wiring board ofother embodiments such as those shown in FIGS. 4A, 4C, 5A, 5B, and thelike.

Electronic devices configured by using the abovementioned printed-wiringboard with a built-in resistive elements 26 are explained compared tocurrent electronic devices. A device with electronic/electrical partsloaded on a printed-wiring board is called a printed circuit board or apackage (PK) herein.

FIG. 8A is a diagram showing the configuration of a conventionalelectronic device 50. On a motherboard (MB) 32, 2 packages (PK) 30, 31are loaded, and a microprocessing unit (MPU) 34 is loaded on one of thePK 30, and a chip set (CS) 36 is loaded on the other PK 31. The MB 32and the PK 30, 31 are respectively connected, for example, with pinjoints 33, and the PK 30 and the MPU 34 or the PK 31 and the CS 36 areconnected with pin joints or reflow soldering 35 using solder bumping.

With a higher frequency electronic device 50, many resistive elementsmay become necessary. Therefore, in the electronic device 50, resistiveelements are off-centrally mounted as a resistive element 40 in the MPU,a chip resistive element 41 mounted on the PK 30, a chip resistiveelement 42 mounted on the MB 32, and the like.

To form the resistive element in the MPU 34, the size of the chip of theMPU naturally becomes larger. To mount the resistive element on the PK30, the size of the PK naturally becomes larger. To mount the resistiveelement on the MB 32, the size of the MB naturally becomes larger. Inaddition, the chip resistive element 41 mounted on the PK 30 and thechip resistive element 42 mounted on the MB 32 are situated far from theMPU 34, so it may deteriorate the quality property of propagationsignals.

FIG. 8B is a diagram of an electronic device 60 configured using theprinted-wiring board related to the present embodiment. Two packages(PK) 30, 31 are mounted on a motherboard (MB) 32, and a MPU 34 ismounted on one of the PK 30 and a CS 36 is mounted of the other PK 31.As mentioned above, a plurality of resistive elements 10 can be built ona printed-wiring board comprising the PK 30.

Therefore, the resistive element 40 in the MPU, the chip resistiveelement 41 mounted on the PK 30 and the chip resistive element 42mounted on the MB 32 in the electronic device 50 shown in FIG. 8A cancollectively be replaced with a resistive element with built-inprinted-wiring board 10.

Because the electronic device 60 shown in FIG. 8B can have the resistiveelement situated close to the MPU 34, the quality property ofpropagation signals can be enhanced compared to the electronic device ofFIG. 8A.

According to an embodiment, in a printed-wiring board with a built-inresistive element, the resistive element forms space enclosed betweentwo electrodes, and by forming print resistance on this space, theresistor material can form a length L and width W with high precision.Therefore, variations of resistance values can be kept low.

According to an embodiment, in a printed-wiring board with a built-inresistive element, the resistive element has a center electrode and aperipheral electrode, and the peripheral electrode completely surroundsthe center electrode. Thus, the space between the two electrodes isformed with high precision, so the resistor material to be formed hereoncan form the length L and width W with a high precision.

According to an embodiment, in a printed-wiring board with a built-inresistive element, the resistive element can be formed on either a corelayer or a built-up layer. Therefore, a plurality of resistive elementscan be formed on one printed-wiring board.

According to an embodiment, by adopting a printed-wiring board with abuilt-in resistive element, a plurality of resistive elements cancollectively be incorporated into a package. An electronic deviceconfigured with packages on which semiconductor devices are mounted anda motherboard on which a plurality of packages are mounted can haveresistive elements close to the semiconductor device collectively, so anelectronic device with high-quality property of propagation signals canbe configured.

Embodiments of the printed-wiring board and electronic device using thesame that are related to the present invention have been describedabove, but these are examples, and the present invention is not limitedto these. Additions, eliminations, modifications, revisions, and thelike that those skilled in the art can easily make with theseembodiments are included in the present invention.

1. A method of manufacturing a printed wiring board with a built-inresistive element, comprising: forming a first electrode on a surface ofan insulating member; forming a second electrode on the surface of theinsulating member so as to form a substantially enclosed space betweenthe first and second electrodes; and filling a resistor material intothe substantially enclosed space.
 2. The method of manufacturing aprinted wiring board with a built-in resistive element according toclaim 1, wherein the first electrode and the second electrode are formedby a semi-additive method.
 3. A method of manufacturing a printed wiringboard with a built-in resistive element comprising: forming a firstelectrode on a surface of an insulating member; forming a secondelectrode adjacent to the first electrode to form a space therebetween,which provides a resistor-filling part between the first electrode andthe second electrode; and forming a resistive element by filling aresistive material provided in the resistor-filling part such that theresistor filling part is substantially enclosed by the first electrodeand the second electrode.
 4. The method of manufacturing a printedwiring board with a built-in resistive element according to claim 3,further comprising: forming a through-hole and filling a filler therein;covering the filler with a through-hole lid plating; and surrounding thethrough-hole lid plating with a ring-shaped pattern.
 5. The method ofmanufacturing a printed wiring board with a built-in resistive elementaccording to claim 3, further comprising: forming a first conductorcircuit on a surface of a first insulating member; forming a secondconductor circuit on a surface of a second insulating member; andconnecting the first conductor circuit and the second conductor circuitby a via conductor, wherein the second conductor circuit comprises thefirst electrode and the second electrode.
 6. The method of manufacturinga printed wiring board with a built-in resistive element according toclaim 3, further comprising: forming a first conductor circuit on asurface of a first insulating member; forming a second conductor circuiton a surface of a second insulating member; and connecting the firstconductor circuit and the second conductor circuit by a via conductor,wherein the first conductor circuit comprises the first electrode andthe second electrode.
 7. The method of manufacturing a printed wiringboard with a built-in resistive element according to claim 3, whereinthe first electrode and the second electrode are formed by at least oneof a semi-additive method, a full-additive method, or a subtractivemethod.